Battery module

ABSTRACT

The present application can provide a battery module, a method for manufacturing method the same and a thermally conductive material applied to the manufacturing method. The present application can provide a battery module having excellent output relative to volume and heat dissipation characteristics, with being manufactured in a simple process and at a low cost, a method for manufacturing the same, and a thermally conductive material applied to the manufacturing method.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 15/735,446, filed on Dec. 11, 2017, which is a national phaseentry under 35 U.S.C. § 371 of International Application No.PCT/KR2016/006232, filed Jun. 13, 2016, which claims the benefit ofpriority based on Korean Patent Application No. 10-2015-0083425 filed onJun. 12, 2015, the disclosures of which are is herein incorporated byreference in their entireties.

TECHNICAL FIELD

The present application relates to a battery module.

BACKGROUND ART

A secondary battery includes a nickel cadmium battery, a nickel hydridebattery, a nickel zinc battery, or a lithium secondary battery, therepresentative example of which is the lithium secondary battery.

The lithium secondary battery mainly uses lithium oxide and carbonmaterials as a positive electrode active material and a negativeelectrode active material, respectively. The lithium secondary batteryincludes an electrode assembly in which a positive electrode plate and anegative electrode plate coated with a positive electrode activematerial and a negative electrode active material, respectively, aredisposed with sandwiching a separator between them, and an exteriormaterial in which the electrode assembly is sealed and held togetherwith an electrolyte, and according to types of the exterior material maybe classified as a can type secondary battery and a pouch type secondarybattery. In the present specification, a single secondary battery may bereferred to as a battery cell.

When it is used in medium and large devices such as an automobile or apower storage device, a large number of battery cells may beelectrically connected to each other to constitute a battery module or abattery pack for increasing capacity and output.

In order to constitute a battery module or a battery pack that suchbattery modules are multiply connected, various fastening parts orcooling equipments, and the like are required, where such fasteningparts or cooling equipments cause an increase in the manufacturing costof the battery module or the battery pack, increase volume and weight,and lower output relative to the increased volume and weight.

DISCLOSURE Technical Problem

The present application can provide a battery module.

Technical Solution

The battery module of the present application may comprise a housing(hereinafter, the housing may be herein referred to as a module case)and a battery cell housed in the housing. In the present application, atleast two or more battery cells may be housed in the housing. In thepresent application, an assembly of the two or more battery cells housedin the housing may be referred to as a battery cell assembly. FIG. 1 isfor an exemplary battery module and illustratively shows a housing (200)and a battery cell assembly (100).

The housing may include at least a bottom plate. At least two convexportions for guiding the battery cell may be formed on the bottom plate.The battery cell may be mounted between the convex portions of thebottom plate.

FIG. 2 is a side view of an exemplary battery module, which shows ashape of the battery cell (400) mounted between the convex portions ofthe bottom plate (210) as mentioned above. The shape, specific number,size, and the like of the convex portions formed on the bottom plate arenot particularly limited and may be appropriately selected consideringthe number or size of the battery cell to be mounted and the shapethereof.

The bottom plate may be a thermally conductive bottom plate. Since theconvex portion formed on the bottom plate is also a part of the bottomplate, it may be thermally conductive. The term thermally conductivebottom plate means a bottom plate having a thermal conductivity of 10W/mK or more, or including at least a region having the thermalconductivity as above. For example, the entire bottom plate, or at leastthe convex portion, may have the above described thermal conductivity.In another example, at least one of the bottom plate and/or the convexportion may comprise a region having the thermal conductivity. Inanother example, the thermal conductivity may be 20 W/mK or more, 30W/mK or more, 40 W/mK or more, 50 W/mK or more, 60 W/mK or more, 70 W/mKor more, 80 W/mK or more, 90 W/mK or more, 100 W/mK or more, 110 W/mK ormore, 120 W/mK or more, 130 W/mK or more, 140 W/mK or more, 150 W/mK ormore, 160 W/mK or more, 170 W/mK or more, 180 W/mK or more, 190 W/mK ormore, or 195 W/mK or more. The higher the value of the thermalconductivity is, the more advantageous it is in terms of the heatdissipation property of the module, and thus the upper limit is notparticularly limited. In one example, the thermal conductivity may beabout 1000 W/mK or less, 900 W/mK or less, 800 W/mK or less, 700 W/mK orless, 600 W/mK or less, 500 W/mK or less, 400 W/mK or less, 300 W/mK orless, or 250 W/mK or less, but is not limited thereto. The kind ofmaterials exhibiting the thermal conductivity as above is notparticularly limited, and for example, includes a metal material such asaluminum, gold, silver, tungsten, copper, nickel or platinum. The bottomplate may be made entirely of the thermally conductive material asabove, or at least a region of the bottom plate may be made of thethermally conductive material. Accordingly, the bottom plate may havethe above-mentioned range of thermal conductivity, or it may comprise atleast the region having the aforementioned thermal conductivity.

In the bottom plate, the region having the above range of thermalconductivity may be a region in contact with a resin layer to bedescribed below. In addition, the region having the thermal conductivitymay be a region in contact with a cooling medium such as cooling water.According to this structure, a structure capable of effectivelydischarging the heat generated from the battery cell outside can beembodied.

In one example, the bottom plate may be in contact with a coolingsystem, such as a water cooling system. At this time, the contact is athermal contact to be described below.

Furthermore, among physical properties mentioned in the presentspecification, when the measured temperature affects the physicalproperties, the physical properties may be physical properties measuredat room temperature unless otherwise stated. In the presentspecification, the term room temperature may refer to any onetemperature within the range of about 10° C. to 30° C., for example, atemperature of about 25° C., about 23° C., or about 20° C. or so.

The housing may further comprise one separate structure, at leastincluding the bottom plate. For example, the housing may furthercomprise a sidewall, etc., forming an internal space, in which theassembly of the battery cells can be housed, together with the bottomplate. The structure of the housing is not particularly limited as longas it includes at least the bottom plate.

The battery module may further include a cooling fin and/or a coolingplate. In this case, the cooling fin may be positioned, for example,between the battery cells guided by the convex portions. At least thecooling fin may be present at the top of the convex portion. At thistime, the cooling fin may be positioned between the battery cells in astate of covering the upper surface of the convex portion.

FIG. 2 illustratively shows a cooling fin (302) positioned between thebattery cells (400) in a state of covering the upper surface of theconvex portion in the bottom plate (210).

Furthermore, the cooling plate may also be positioned between thesurface of the bottom plate, formed between the convex portions, and thebattery cells. FIG. 2 illustratively shows such a cooling plate (301).

The battery module may comprise any one or both of the cooling fin andthe cooling plate.

The cooling fin and/or the cooling plate may have a thermal conductivityin the same range as mentioned in the bottom plate, and thus may be madeof a metal material such as aluminum, gold, pure silver, tungsten,copper, nickel or platinum like the bottom plate.

The number of battery cells in the housing is controlled by the desiredoutput depending on a use of the battery module and the like, withoutbeing particularly limited. The battery cells may be electricallyconnected to each other.

The type of the battery cell is not particularly limited, and variousknown battery cells can all be applied. In one example, the battery cellmay be a pouch type battery. Referring to FIG. 3, the pouch type battery(100) may typically comprise an electrode assembly, an electrolyte and apouch exterior material. FIG. 3 is an exploded perspective viewschematically showing the configuration of an exemplary pouch typebattery, and FIG. 4 is an assembled perspective view of theconfiguration of FIG. 3.

The electrode assembly (110) included in the pouch type battery (100)may be a shape that at least one positive electrode plate and at leastone negative electrode plate are disposed with sandwiching a separatorbetween them. The electrode assembly (110) may be classified as awinding form in which one positive electrode plate and one negativeelectrode plate are wound together with a separator, or a stacking formin which a plurality of positive electrode plates and a plurality ofnegative electrode plates are alternately laminated with sandwiching aseparator between them.

The pouch exterior material (120) may be configured in the form of, forexample, an external insulating layer, a metal layer, and an internaladhesive layer. Such an exterior material (120) may comprise a thin filmof metal such as aluminum by protecting internal elements such as theelectrode assembly (110) and the electrolyte, compensating theelectrochemical properties of the electrode assembly (110) and theelectrolyte and considering heat dissipation. Such a metal thin film maybe interposed between insulating layers formed of an insulating materialin order to secure electrical insulation of the film with elements suchas the electrode assembly (110) and the electrolyte or other elementsoutside the battery (100).

In one example, the exterior material (120) may comprise an upper pouch(121) and a lower pouch (122), and in at least one of the upper pouch(121) and the lower pouch (122) an internal space (I) having a concaveform may be formed. The electrode assembly (110) can be housed in theinternal space (I) of such a pouch. Sealing portions (S) are provided onthe outer peripheries of the upper pouch (121) and the lower pouch (122)and these sealing portions (S) are adhered to each other so that theinternal space accommodating the electrode assembly (110) can be sealed.

Each electrode plate of the electrode assembly (110) is provided with anelectrode tab, and one or more electrode tabs may be connected to anelectrode lead. The electrode lead is interposed between the sealingportions (S) of the upper pouch (121) and the lower pouch (122) andexposed outside the exterior material (120), so that it can function asan electrode terminal of the secondary battery (100).

However, the shape of the above described pouch type battery is oneexample, and the battery cell which is applied to the presentapplication is not limited to the above type. In the presentapplication, various types of known pouch type batteries or other typesof batteries can be all applied as battery cells.

The battery module may further comprise a resin layer, for example, aresin layer having a thermal conductivity of 2 W/mK or more. The resinlayer may be present in at least one region among between the coolingfin and the convex portion, specifically, between the region of thecooling fin covering the upper surface of the convex portion, and theconvex portion, between the cooling plate and the bottom plate, betweenthe cooling fin and the battery cell or between the cooling plate andthe battery cell. The resin layer may be in contact with the coolingfin, the cooling plate, the convex portion, the bottom plate, and/or thebattery cell. In this case, the contact is a thermal contact. The termthermal contact may mean the case where heat can be transferred from anyone target to other targets even if a space is present between the resinlayer and the cooling fin, the cooling plate, the convex portion, thebottom plate and/or the battery cell to a certain extent.

Such a resin layer may cover at least about 10%, at least about 15%, atleast about 20%, at least about 25%, at least about 30%, at least about35%, at least about 40%, at least about 45%, at least about 50% or atleast about 55% of the entire area of the bottom plate. At least, theresin layer may cover the above described convex portion of the bottomplate. The upper limit of the area of the resin layer is notparticularly limited, and is, for example, about 100%.

In the present application, the term resin layer is a layer containing aresin component, and in one example, the resin layer may be also anadhesive layer. In one example, the battery module comprises the bottomplate, the battery cell, the cooling fin and the cooling plate, andcomprises the resin layer in contact with both between the cooling finand the bottom plate and/or between the bottom plate and the coolingplate. Furthermore, the contact means the above described thermalcontact, which may mean a state in which the resin layer is in directcontact with the bottom plate or the like, or other elements, forexample an insulating layer and the like, are present between the resinlayer and the bottom plate or the like, but the other elements do notdisturb transferring heat from the resin layer to the bottom plate orthe like. To do not disturb transferring heat as above means the casethat even if other elements (e.g., an insulating layer) are presentbetween the resin layer and the bottom plate or the like the totalthermal conductivity of the other elements and the resin layer is about1.5 W/MK or more, about 2 W/mK or more, 2.5 W/mK or more, 3 W/mK ormore, 3.5 W/mK or more, or 4 W/mK or more, or the total thermalconductivity of the resin layer and the bottom plate or the like incontact with this is included within the above range even if the otherelements are present. The thermal conductivity of the thermal contactmay be 50 W/mK or less, 45 W/mK or less, 40 W/mK or less, 35 W/mK orless, 30 W/mK or less, 25 W/mK or less, 20 W/mK or less, 15 W/mK orless, 10 W/mK or less, 5 W/mK or less, 4.5 W/mK or less, or about 4.0W/mK or less. If other elements are present, this thermal contact can beachieved by controlling the thermal conductivity and/or thickness of theother elements.

The resin layer may also be present between the cooling fin and/or thecooling plate and the battery cell, if necessary.

The present application can embody a module housing more battery cellsper unit volume through adopting the above structure, with greatlyreducing various fastening parts or cooling equipments of the modulewhich have been conventionally required on constructing general batterymodules or battery packs as an assembly of such modules and securingheat dissipation properties. Accordingly, the present application canprovide a battery module that is smaller and lighter, and has higheroutput.

As described above, the thermally conductive region or the thermallyconductive bottom plate or the like may be a region in contact with acooling medium such as cooling water.

The resin layer may be in the form of a thin layer or may fill a spacebetween the bottom plate and the cooling fin and/or the cooling plate orthe like. The thickness of the resin layer can be, for example, in therange of about 100 μm to 5 mm or in the range of about 200 μm to 5 mm.The structure of the present application has advantageous heatdissipation characteristics, if the resin layer is thin, andadvantageous insulation characteristics, if it is thick, and thus inconsideration of this point, the appropriate thickness may be set. Thethickness may be a thickness of the thinnest region, a thickness of thethickest region, or an average thickness in the resin layer.

The resin layer or the battery module to which the resin layer isapplied may have at least one physical property of physical propertiesto be described below. Each physical property to be described below isindependent, and any one physical property does not take priority overother physical properties, and the resin layer can satisfy at least oneor two or more of physical properties described below.

For example, the resin layer is a thermally conductive resin layer,which may have a thermal conductivity of about 2 W/mK or more, 2.5 W/mKor more, 3 W/mK or more, 3.5 W/mK or 4 W/mK or more. The thermalconductivity may be 50 W/mK or less, 45 W/mK or less, 40 W/mK or less,35 W/mK or less, 30 W/mK or less, 25 W/mK or less, 20 W/mK or less, 15W/mK or less, 10 W/mK or less, 5 W/mK or less, 4.5 W/mK or less, orabout 4.0 W/mK or less. When the resin layer is a thermally conductiveresin layer as above, the bottom plate and the like to which the resinlayer is attached may be a region having the above described thermalconductivity of 10 W/mK or more. At this time, the region of the modulecase representing the thermal conductivity may be a region in contactwith a cooling medium, for example, cooling water or the like. Thethermal conductivity of the resin layer is, for example, a valuemeasured according to ASTM D5470 standard or ISO 22007-2 standard. Amethod for setting the thermal conductivity of the resin layer in theabove range is not particularly limited. For example, the thermalconductivity of the resin layer can be controlled through the type ofthe resin used in the resin layer and/or use of fillers. For example,among resin components generally known to be usable as adhesives, it isknown that acrylic resins, urethane resins and silicone resins havesimilar heat conduction properties to each other, epoxy resins haveexcellent thermal conductivity compared to them, and olefin resins havehigh thermal conductivity over epoxy resins. Therefore, if necessary, itis possible to select one having an excellent thermal conductivity fromthe resins. However, in general, the desired thermal conductivity ishardly secured by only the resin component, and it is also possible toapply a method in which the filler component having excellent thermalconductivity is contained in the resin layer at an appropriate ratio asdescribed below.

The resin layer or the battery module to which the resin layer isapplied may have a thermal resistance of 5 K/W or less, 4.5 K/W or less,4 K/W or less, 3.5 K/W or less, 3 K/W or less, or about 2.8 K/W. Whenthe resin layer or the battery module to which the resin layer isapplied is adjusted so as to exhibit such a range of thermal resistance,excellent cooling efficiency or heat dissipation efficiency can besecured. A method for measuring the thermal resistance is notparticularly limited. For example, it can be measured according to ASTMD5470 standard or ISO 22007-2 standard.

The resin layer can have an appropriate adhesive force in considerationof effective fixing of the battery cells, and impact resistance andvibration resistance in the process of using the module. In one example,the resin layer may have an adhesive force of about 1,000 gf/10 mm orless, about 950 gf/10 mm or less, about 900 gf/10 mm or less, about 850gf/10 mm or less, about 800 gf/10 mm or less, about 750 gf/10 mm orless, about 700 gf/10 mm or less, about 650 gf/10 mm or less, or about600 gf/10 mm or less. In another example, the adhesive force of theresin layer may be about 50 gf/10 mm or more, about 70 gf/10 mm or more,about 80 gf/10 mm or more, or about 90 gf/10 mm or more. The adhesiveforce may be a value measured at a peel rate of about 300 mm/min and apeel angle of 180 degrees. In addition, the adhesive force may be anadhesive force to the module case in contact with the resin layer. Forexample, when an insulating layer is formed between the bottom plate orthe like in contact with the resin layer in the module case and theresin layer as described below, the adhesive force to the module casemay be an adhesive force to the module case on which the insulatinglayer is formed. If such an adhesive force can be secured, an excellentadhesive force can be represented for various materials, for example,various materials such as a case and a battery cell or the like includedin a battery module. If such a range of the adhesive force is secured, avolume change during charging and discharging of the battery cell in thebattery module, a change of the operating temperature in the batterymodule or peeling by hardening and shrinking the resin layer may beprevented to secure excellent durability. Such an adhesive force can beensured by, for example, constituting the resin layer as an adhesivelayer. That is, the adhesive force that a known adhesive material canexhibit is well known, whereby a material can be selected inconsideration of such an adhesive force.

It may be required that the resin layer is formed such that it cannot bedetached or peeled off from the module case of the battery module or thebattery cells or cracks cannot be generated after a thermal shock test,for example a thermal shock test repeating 100 cycles, one cycle ofwhich comprises holding it at a low temperature of about −40° C. for 30minutes and then again holding it for 30 minutes with raising thetemperature to 80° C. For example, when the battery module is applied toa product, such as an automobile, requiring a long warranty period (inthe case of the automobile, at least about 15 years), the same level ofperformance as above may be required to secure durability.

The resin layer may be an electrically insulating resin layer. In theabove described structure, the resin layer may exhibit electricalinsulation to maintain the performance of the battery module and tosecure stability. The electrically insulating resin layer may have abreakdown voltage of about 3 kV/mm or more, about 5 kV/mm or more, about7 kV/mm or more, 10 kV/mm or more, 15 kV/mm or more, or 20 kV/mm ormore, measured according to ASTM D149. The higher the value of thebreakdown voltage, the resin layer shows more excellent insulation,without being particularly limited, but it may be about 50 kV/mm orless, 45 kV/mm or less, 40 kV/mm or less, 35 kV/mm or less, or 30 kV/mmor less in consideration of composition of the resin layer and the like.The breakdown voltage may also be controlled by controlling insulationof the resin component in the resin layer and, for example, thebreakdown voltage can be controlled by applying insulating fillers inthe resin layer. In general, among the thermally conductive fillers,ceramic fillers as described below are known as a component capable ofensuring insulation.

As the resin layer, a flame retardant resin layer can be applied inconsideration of stability. In the present application, the term flameretardant resin layer may mean a resin layer showing a V-0 grade in UL94 V Test (Vertical Burning Test). This can ensure stability againstfire and other accidents that may occur in the battery module.

The resin layer may have a specific gravity of 5 or less. In anotherexample, the specific gravity may be 4.5 or less, 4 or less, 3.5 orless, or 3 or less. The resin layer showing such a range of the specificgravity is advantageous for manufacturing a battery module which islighter. The lower the specific gravity, the more advantageous themodule lightening is, and thus the lower limit is not particularlylimited. For example, the specific gravity may be about 1.5 or more, or2 or more. In order for the resin layer to show the specific gravity inthe same range as above, the components added to the resin layer can beadjusted. For example, when thermally conductive fillers are added,fillers capable of securing the desired thermal conductivity even at alow specific gravity, if possible, that is, a method for applyingfillers having its own low specific gravity or applying surface-treatedfillers may be used.

It is appropriate that the resin layer contains no volatile substance,if possible. For example, the resin layer may have a ratio ofnon-volatile components of 90% by weight or more, 95% by weight or more,or 98% by weight or more. In the above, the non-volatile components andthe ratio thereof can be specified in the following manner. That is, thenon-volatile content can be defined as the remaining portion aftermaintaining the resin layer at 100° C. for about 1 hour, and thus theratio can be measured based on the initial weight of the resin layer anda ratio after maintaining it at 100° C. for about 1 hour.

In addition, the resin layer will have excellent resistance todeterioration, if necessary, but it may be required to have stability inwhich the surface of the module case or the battery cell does not reactas chemically as possible.

It may be also advantageous that the resin layer has a low shrinkageratio during curing or after curing. This can prevent peeling or voidgeneration which may occur in processes of manufacturing and using themodule. The shrinkage ratio can be appropriately adjusted within a rangecapable of exhibiting the above described effect, and, for example, itcan be less than 5%, less than 3%, or less than about 1%. The lower thevalue of the shrinkage rate is, the more advantageous it is, and thusthe lower limit is not particularly limited.

It may be also advantageous that the resin layer has a low coefficientof thermal expansion (CTE). This can prevent peeling or void generationwhich may occur in processes of manufacturing and using the module. Thecoefficient of thermal expansion can be appropriately adjusted within arange capable of exhibiting the above described effect, and, forexample, it can be less than 300 ppm/K, less than 250 ppm/K, less than200 ppm/K, less than 150 ppm/K or less than about 100 ppm/K. The lowerthe value of the coefficient of thermal expansion is, the moreadvantageous it is, and thus the lower limit is not particularlylimited.

The tensile strength of the resin layer can be appropriately adjusted,whereby it is possible to provide a module showing appropriatedurability by ensuring excellent impact resistance and the like. Thetensile strength can be adjusted, for example, in the range of about 1.0MPa or more.

The elongation of the resin layer can be appropriately adjusted, wherebyit is possible to provide a module showing appropriate durability byensuring excellent impact resistance and the like. The elongation can beadjusted, for example, in the range of about 10% or more or about 15% ormore.

It may be advantageous that the resin layer exhibits an appropriatehardness. For example, if the hardness of the resin layer is too high,the resin layer may become excessively brittle to adversely affect thereliability. In addition, through control of the hardness of the resinlayer, the impact resistance and the vibration resistance can besecured, and the durability of the product can be secured. The resinlayer may have a hardness in Shore A type of, for example, less than100, 99 or less, 98 or less, 95 or less, or 93 or less, or a hardness inShore D type of less than about 80, about 70 or less, about 65 or lessor about 60 or less. The lower limit of the hardness is not particularlylimited. For example, the hardness in Shore A type may be 60 or more, orthe hardness in Shore 00 type may be 5 or more or about 10 or more. Thehardness of the resin layer generally depends on the type and the ratioof the filler contained in the resin layer, and if an excessive amountof the filler is contained, the hardness is usually increased. However,the resin component included in the resin layer also affects thehardness, as the silicone resins generally show a lower hardness overother resins such as epoxy or urethane.

The resin layer may also have a 5% weight loss temperature in athermogravimetric analysis (TGA) of 400° C. or more, or an 800° C.remaining amount of 70% by weight or more. This characteristic canfurther improve the stability of the battery module at a hightemperature. In another example, the 800° C. remaining amount may be atleast about 75% by weight, at least about 80% by weight, at least about85% by weight, or at least about 90% by weight. In another example, the800° C. remaining amount may be about 99% by weight or less. Thethermogravimetric analysis (TGA) can be carried out within a range of25° C. to 800° C. at a rate of temperature increase of 20° C./min undera nitrogen (N2) atmosphere of 60 cm3/min. The thermogravimetric analysis(TGA) results can also be achieved through controlling the compositionof the resin layer. For example, the 800° C. remaining amount depends onthe type and proportion of the filler contained in the resin layer, andif an excess amount of the filler is contained, the remaining amountincreases. However, since silicone resins generally have higher heatresistance than other resins such as epoxy or urethane, the remainingamount is higher and the resin component included in the resin layeralso affects its hardness.

If the battery cell can be effectively fixed and, if necessary, theabove-mentioned physical properties can be given, it is not particularlylimited and all the known curable resin materials can be used. Thematerial that can be used may include acrylic resins, epoxy resins,urethane resins, olefin resins, urethane resins, EVA (ethylene vinylacetate) resins or silicone resins and the like, and thus the resinlayer may comprise the resin. The resin layer may comprise the resin asa main component of the resin components. That is, the acrylic resin,the epoxy resin, the urethane resin, the olefin resin, the urethaneresin, the ethylene vinyl acetate (EVA) resin, the silicone resin or thelike may be contained in an amount of about 70% or more, about 75% ormore, about 80% or more, about 85% or more or about 90% or more on thebasis of weight. The ratio may be about 99% or less or about 95% orless.

A material for forming the resin layer, that is, a resin composition maybe an adhesive material as described above and may be a solvent type, anaqueous type or a solvent-free type, but it may be appropriate that theresin composition is a solvent-free type in consideration of theconvenience of a manufacturing process to be described below.

The resin layer material may be an active energy ray curable type, amoisture curable type, a thermosetting type or an ambient temperaturecurable type, and it may be suitably an ambient temperature curable typein consideration of the convenience of a manufacturing process to bedescribed below.

The resin layer may include fillers in consideration of thermalconductivity, insulation, heat resistance (TGA analysis) or specificgravity, and the like, as described above. The use of appropriatefillers can ensure the above described range of the thermal conductivityand the like. In one example, the filler may be thermally conductivefillers. In the present application, the term thermally conductivefiller means a material having a thermal conductivity of at least about1 W/mK, at least about 5 W/mK, at least about 10 W/mK, or at least about15 W/mK. The thermal conductivity of the thermally conductive filler maybe about 400 W/mK or less, about 350 W/mK or less, or about 300 W/mK orless. The kind of the usable thermally conductive filler is notparticularly limited, but ceramic fillers can be applied inconsideration of insulation and the like. For example, ceramic particlessuch as alumina, MN (aluminum nitride), BN (boron nitride), siliconnitride, SiC or BeO may be used. In addition, if the insulatingproperties of the resin layer can be ensured, it may be also consideredto apply carbon fillers such as graphite. The shape and ratio of thefiller contained in the resin layer are not particularly limited andthey may be selected in consideration of the viscosity of the resincomposition, the possibility of settling in the resin layer, the desiredheat resistance and thermal conductivity, insulation, filling effect ordispersion and the like. Generally, the larger the size of the filler,the viscosity of the resin composition increases and the possibility ofsettling the filler in the resin layer increases. Also, the smaller thesize, the thermal resistance tends to be increased. Therefore, asuitable type of filler may be selected in consideration of the abovepoints, and two or more fillers may be used, if necessary. In addition,considering the filling amount, it is advantageous to use sphericalfillers, but fillers in the form of needle or plate can be also used inconsideration of network formation and conductivity. In one example, theresin layer may comprise thermally conductive fillers having an averageparticle diameter within a range of 0.001 μm to 80 μm. In anotherexample, the average particle diameter of the filler may be 0.01 μm ormore, 0.1 μm or more, 0.5 μm or more, 1 μm or more, 2 μm or more, 3 μmor more, 4 μm or more, 5 μm or more or about 6 μm or more. In anotherexample, the average particle diameter of the filler may be about 75 μmor less, about 70 μm or less, about 65 μm or less, about 60 μm or less,about 55 μm or less, about 50 μm or less, about 45 μm or less, about 40μm or less, about 35 μm or less, about 30 μm or less, about 25 μm orless, about 20 μm or less, about 15 μm or less, about 10 μm or less, orabout 5 μm or less.

The ratio of the filler contained in the resin layer can be selected inconsideration of the characteristics of the resin layer, such that theabove described characteristics, for example, thermal conductivity,insulation, and the like can be secured. For example, the filler may becontained within a range of about 50 to 2,000 parts by weight based on100 parts by weight of the resin components in the resin layer. Inanother example, the part by weight of the filler may be at least about100 parts by weight, at least about 150 parts by weight, at least about200 parts by weight, at least about 250 parts by weight, at least about300 parts by weight, at least about 350 parts by weight, at least about400 parts by weight, at least about 500 parts by weight, at least about550 parts by weight, at least about 600 parts by weight, or at leastabout 650 parts by weight.

The resin layer may further comprise a viscosity modifier, for example,a thixotropic agent, a diluent, a dispersant, a surface treatment agent,or a coupling agent, if necessary, for adjusting viscosity, for example,for raising or lowering viscosity or for controlling viscosity accordingto a shear force.

The thixotropic agent can control the viscosity according to the shearforce of the resin composition to effectively perform the manufacturingprocess of the battery module. As the usable thixotropic agent, fumedsilica and the like can be exemplified.

The diluent or dispersant is usually used for lowering the viscosity ofthe resin composition, and various agents known in the art can be usedwithout limitation as long as they can exhibit the above action.

The surface treatment agent is used for surface treatment of the fillerintroduced into the resin layer, and various agents known in the art canbe used without limitation as long as they can exhibit the above action.

The coupling agent can be used, for example, to improve dispersibilityof the thermally conductive filler such as alumina, and various agentsknown in the art can be used without limitation as long as they canexhibit the above action.

The resin layer may further comprise a flame retardant or a flameretardant aid. Such a resin layer can form a flame retardant resinlayer. As the flame retardant, various flame retardants known in the artcan be applied without any particular limitation and, for example, asolid filler type flame retardant or a liquid flame retardant can beapplied. An example of the flame retardant includes an organic flameretardant such as melamine cyanurate and an inorganic flame retardantsuch as magnesium hydroxide, but is not limited thereto.

If the amount of fillers filled in the resin layer is large, a liquidtype flame retardant (TEP, triethyl phosphate, or TCPP,tris(1,3-chloro-2-propyl) phosphate, etc.) may be also used. Inaddition, a silane coupling agent capable of acting as a flame retardantsynergist may be also added.

The resin layer may comprise any one or two or more of the abovecomponents.

In one example, the battery module may further comprise an insulatinglayer between the bottom plate and the battery cell or between the resinlayer and the bottom plate, the cooling fin and/or the cooling plate. Byadding an insulating layer, it is possible to prevent problems such asan electrical short circuit phenomenon or an outbreak of fire accordingto contact between the cell and the case due to an impact that may occurin the use process. The insulating layer may be formed by using aninsulating sheet having high insulation and thermal conductivity or byapplying or injecting a material exhibiting insulation. For example, inthe method for manufacturing a battery module to be described below, aprocess of forming an insulating layer may be performed before injectingthe resin composition. A so-called TIM (Thermal Interface Material) orthe like may be applied to the formation of the insulating layer.Alternatively, the insulating layer may be formed with an adhesivematerial and, for example, the insulating layer may be also formed usinga resin layer having little or no content of fillers such as thermallyconductive fillers. As the resin component that can be used for formingthe insulating layer, an acrylic resin, PVC (poly(vinyl chloride)), anolefin resin such as PE (polyethylene), an epoxy resin, silicone, or arubber component such as an EPDM (ethylene propylene diene monomer)rubber and the like may be exemplified, without being limited thereto.The insulating layer may have a breakdown voltage of at least about 5kV/mm, at least about 10 kV/mm, at least about 15 kV/mm, at least 20kV/mm, at least 25 kV/mm, or at least 30 kV/mm, as measured according toASTM D149. The higher the value of the breakdown voltage, the moreexcellent insulation is shown, without being particularly limited. Forexample, the breakdown voltage of the insulating layer may be about 100kV/mm or less, 90 kV/mm or less, 80 kV/mm or less, 70 kV/mm or less or60 kV/mm or less. A thickness of the insulating layer may beappropriately set in consideration of insulation or thermal conductivityof the insulating layer and, for example, be about 5 μm or more, about10 μm or more, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm ormore, 60 μm or more, 70 μm or more, 80 μm or more or 90 μm or more. Theupper limit of thickness is not particularly limited and may be, forexample, about 1 mm or less, about 200 μm or less, 190 μm or less, 180μm or less, 170 μm or less, 160 μm or less or 150 μm or less.

The present application also relates to a method for manufacturing abattery module, for example, the above-mentioned battery module.

The method for manufacturing the above module is not particularlylimited, and may comprise a step of housing the cooling fin and/or thecooling plate and the battery cells after forming the resin compositionlayer on the surface of the bottom plate, at least on the convex portionwith the above-mentioned resin composition. A step of curing the resincomposition may be further performed at an appropriate time during theabove process.

In the present application, the term resin composition may mean a stateof the resin layer before curing, and the term resin layer may mean astate of the resin layer after curing.

The method for forming the resin composition layer on the bottom plateis not particularly limited and can be carried out in a known manner.

In the above, the kind of the resin composition is not particularlylimited, and a suitable resin composition capable of exhibiting thedesired physical properties can be selected.

For example, the injected resin composition above may be a resincomposition capable of satisfying the physical properties such as theabove-mentioned thermal conductivity or forming a resin layer comprisingcomponents for the properties.

Such a resin composition may be a resin composition of a solvent type,an aqueous type or a solvent-free type, as described above, and may besuitably a solvent-free type resin composition.

In addition, the resin composition may be a resin composition of anactive energy radiation curable type, a moisture curable type, athermosetting type or an ambient temperature curable type and the like,and may be suitably an ambient temperature curable type resincomposition.

The resin composition may be a resin composition comprising at least oneof various additives such as the above-mentioned thermally conductivefillers.

Such a resin composition may be constituted by one-component type,two-component type or three-component type and the like.

Such a resin composition can be cured, if necessary, where the methodfor curing the resin composition is not particularly limited.

For example, the above step may be performed by a method for irradiatingthe resin composition with active energy rays such as ultraviolet whenthe resin composition is an active energy ray curable type, a method formaintaining it under an appropriate moisture in the case of the moisturecurable type, a method for applying an appropriate heat to it in thecase of the heat curable type or a method for maintaining it at roomtemperature in the case of the ambient temperature curable type or thelike.

In addition, heat may be also applied for a short period so as to be,for example, about 40° C. to 50° C. in a condition that does not affectstability of the battery cell in terms of tack time and processabilitybefore or during curing or before or during housing the battery cell.

The present application also relates to a resin composition that can beused in the manufacturing method or in forming the battery module of theabove-mentioned structure.

As described above, the resin composition is not particularly limited aslong as the battery cell can be effectively fixed and, if necessary, theabove-mentioned physical properties can be given, and all the knownresin compositions can be used.

Such a resin composition may include, but is not limited to, an acrylicresin composition, an epoxy resin composition, a urethane resincomposition, an olefin resin composition, a urethane resin composition,an EVA (ethylene vinyl acetate) resin composition or a silicone resincomposition.

The resin composition may be a solvent type resin composition, anaqueous resin composition, or a solvent-free type resin composition, andmay suitably be a solvent-free resin composition.

The resin composition may be an active energy ray curable resincomposition, a moisture curable resin composition, a thermosetting resincomposition or an ambient temperature curable resin composition, and maysuitably be an ambient temperature curable resin composition.

For example, the resin composition prepared by adding an additive suchas the above-mentioned filler to a resin composition capable of formingacrylic adhesives, epoxy adhesives, urethane adhesives, olefinadhesives, EVA (ethylene vinyl acetate) adhesives or silicone adhesivesin an appropriate amount in consideration of the desired physicalproperties may be applied to the above-mentioned method.

The resin composition as above may comprise a radical initiator and acatalyst thereof in consideration of curability at room temperature andthe like. For example, the resin composition may comprise an acylperoxide initiator such as benzoyl peroxide and a catalyst for theinitiator, such as a toluidine compound, whereby a suitable curingsystem may be embodied.

The resin composition may comprise various components, if necessary, inaddition to the above components.

The present application also relates to a battery pack, for example, abattery pack comprising two or more of the above-described batterymodules. In the battery pack, the battery modules may be electricallyconnected to each other. A method for electrically connecting two ormore battery modules to form a battery pack is not particularly limited,and all the known methods may be applied.

The present application also relates to a device comprising the batterymodule or the battery pack. An example of such a device may include anautomobile such as an electric car, but is not limited thereto, and mayinclude all applications requiring secondary batteries as outputs. Forexample, a method for constructing the automobile using the batterymodule or the battery pack is not particularly limited, and a generalmethod can be applied.

Advantageous Effects

The present application can provide a battery module having excellentoutput relative to volume and heat dissipation characteristics, withbeing manufactured in a simple process and at a low cost, a method formanufacturing the same, and a resin composition applied to themanufacturing method.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1 and 2 are views showing the structure of an exemplary batterymodule.

FIGS. 3 and 4 are views showing an exemplary pouch type battery.

DESCRIPTION OF REFERENCE NUMERALS

-   -   100: battery cell assembly    -   200: housing    -   210: bottom plate    -   301: cooling plate    -   302: cooling fin    -   400: battery cell    -   100: pouch type battery    -   110: electrode assembly    -   120: exterior material    -   121: upper pouch    -   122: lower pouch    -   S: sealing portion

MODE FOR INVENTION

Hereinafter, a battery module according to the present application willbe described with reference to examples and comparative examples, butthe scope of the present application is not limited by the scope set outbelow.

1. Evaluation Method for Thermal Conductivity of Resin Layer

The thermal conductivity of the resin layer was measured according toASTM D5470 standard. That is, according to the standard of ASTM D5470, aresin layer was positioned between two copper bars and then, aftercontacting one of the two copper with a heater and contacting the otherwith a cooler, the heater was maintained at a constant temperature andthe capacity of the cooler was adjusted to create a thermal equilibriumstate (a state showing a temperature change of about 0.1° C. or less for5 minutes). The temperature of each copper bar was measured in thethermal equilibrium state, and the thermal conductivity (K, unit: W/mK)was evaluated according to the following equation. On evaluating thethermal conductivity, the pressure applied to the resin layer wasadjusted to be about 11 Kg/25 cm² and the thermal conductivity wascalculated based on the final thickness when the thickness of the resinlayer was changed during the measurement.K=(Q×dx)/(A×dT)  <Thermal Conductivity Equation>

In the above equation, K is the thermal conductivity (W/mK), Q is heatmoving per unit time (unit: W), dx is the thickness (unit: m) of theresin layer, A is the cross sectional area (unit: m2) of the resinlayer, and dT is the temperature difference (unit: K) of the copperbars.

2. Evaluation Method for Specific Gravity

The specific gravity of the resin layer was measured according to ASTMD792 standard. For example, according to the above standard, aftermeasuring the weight of the resin layer and again measuring the weightin water, the density and specific gravity may be calculated through thedifference in the measured weights, or after putting a predeterminedamount of powder or pellet (for example, about 5 g) into the alreadymeasured volume in the pyrometer, the specific gravity may be calculatedat 73.4F° through the difference of the weight and the volume.

3. Thermogravimetric Analysis (TGA) Method

The thermogravimetric analysis was performed using a TA400 instrumentfrom TA Instrument. Analysis was carried out using about 10 mg of theresin layer, and the analysis was carried out in a temperature range of25° C. to 800° C. and at a heating rate of 20° C./min under a nitrogen(N2) atmosphere of 60 cm³/min

4. Measurement of Breakdown Voltage

The breakdown voltage of the resin layer was evaluated according to ASTMD149 standard. The breakdown voltage means a voltage applied until themoment that a material loses insulation, and the insulation is lost byrapidly increasing conductivity at a high voltage equal to or higherthan a certain level. The minimum voltage required to cause insulationbreakdown is called the breakdown voltage, and the insulation isgenerated by completely conducting an arc through a specimen. A voltagegradient may be obtained by dividing the voltage at the moment ofbreakdown by the insulation thickness. The breakdown voltage wasmeasured using a Backman Industrial PA70-1005/202 instrument, where thethickness of the specimen (resin layer) was about 2 mm and the diameterwas about 100 mm

5. Adhesive Force Measurement

A bottom plate of an aluminum module case, on which an insulating film(epoxy and/or polyester insulating layer) is formed, and a PET(poly(ethylene terephthalate)) film were attached using a resin layer,where the width to be attached was about 10 mm. At this time, thethickness of the resin layer was about 1 mm. The attachment is performedby loading the uncured resin composition between the insulating film andthe PET film, and curing it. Thereafter, while peeling the PET film fromthe insulating side with a speed of about 300 mm/min and a peel angle of180 degrees, the adhesive force is measured.

6. Measurement of Hardness

The hardness of the resin layer was measured according to ASTM D 2240and JIS K 6253 standards. It was performed using Shore A, durometerhardness apparatus, where the initial hardness was measured by applyinga load of 1 Kg or more (about 1.5 Kg) to the surface of the flat sample(resin layer) and the hardness was evaluated by identifying the measuredvalue stabilized after 15 seconds.

7. Reliability Evaluation of Battery Module

The reliability of the battery module was evaluated by measuring thethermal resistance and temperature of the module. The thermal resistanceof the battery module was evaluated by positioning the module betweenthe upper and lower blocks of the measuring instrument, executing theDynTIM tester software of the controlling computer, determining theheating current and the measuring time on the software to input them,completing the setting of parameters such as the measurement pressureand the thermal resistance measurement conditions, and allowing theT3Ster and DynTIM tester controlled by the software to measure thermalresistance values based on the measurement conditions. The moduletemperature was measured by attaching a contact type thermometer basedon location of the module. The thermal resistance and the moduletemperature were measured in a state of the bottom plate of the batterymodule in contact with the water cooling system. The reliability of eachevaluation result was classified into the following criteria.

<Reliability Evaluation Criteria According to Thermal ResistanceEvaluation>

Good: thermal resistance of 2.5 K/W or less

Fair: thermal resistance of more than 2.5 K/W up to 3 K/W

Poor: thermal resistance of more than 3 K/W

<Reliability Evaluation Criteria According to Module Temperature>

Good: temperature of 50° C. or less

Poor: temperature of more than 50° C.

Example 1

Preparation of Resin Composition

Alumina (particle size distribution: 1 μm to 60 μm) was mixed with atwo-component type urethane adhesive composition (main component:HP-3753 (KPX Chemical), hardener: TLA-100 (manufactured by Asahi Kasei))in an amount that the two-component type urethane adhesive compositioncan exhibit a thermal conductivity of about 3 W/mK after curing (in arange of about 600 to 900 parts by weight relative to 100 parts byweight of the two-component total solid content) to produce a resincomposition having a viscosity at room temperature of about 250,000 cP,which was applied in manufacturing the following battery module.

Manufacture of Battery Module

Using the prepared resin composition, a battery module having a shape asshown in FIG. 2 was produced. In the form of FIG. 2, the bottom plate(101), the cooling fins (201) and the cooling plate (202) were all madeof aluminum. After coating the resin composition on the surface of thebottom plate so as to cover the entire bottom plate, the cooling finsand the cooling plate were mounted on the top of the bottom plate,respectively, the battery cells were mounted between the cooling finsmounted so as to cover the surface of the convex portion, and the resincomposition was cured to prepare a battery module.

Example 2

Preparation of Resin Composition

Alumina (particle size distribution: 1 μm to 60 μm) was mixed with atwo-component type silicone adhesive composition (main component:SL5100A (manufactured by KCC), hardener: SL5100B (manufactured by KCC))in an amount that the two-component type silicone adhesive compositioncan exhibit a thermal conductivity of about 3 W/mK after curing (in arange of about 800 to 1200 parts by weight relative to 100 parts byweight of the two-component total solid content) to produce a resincomposition having a viscosity at room temperature of about 130,000 cP,which was applied in manufacturing the following battery module.

Manufacture of Battery Module

A battery module was produced in the same manner as Example 1, exceptfor using the prepared resin composition.

Example 3

A battery module was produced in the same manner as Example 1, exceptfor using the resin composition prepared so as to have a viscosity atroom temperature of about 350,000 cP by mixing alumina (particle sizedistribution: 1 μm to 60 μm) with a two-component type urethane adhesivecomposition (main component: PP-2000 (KPX Chemical), hardener: TLA-100(manufactured by Asahi Kasei)) in an amount that the two-component typeurethane adhesive composition can exhibit a thermal conductivity ofabout 3.5 W/mK after curing (in a range of about 600 to 900 parts byweight relative to 100 parts by weight of the two-component total solidcontent).

Example 4

A battery module was produced in the same manner as Example 1, exceptfor using the resin composition prepared so as to have a viscosity atroom temperature of about 500,000 cP by mixing alumina (particle sizedistribution: 1 μm to 60 μm) with an ambient temperature curable typeepoxy adhesive composition obtained from Kukdo Chemical in an amountthat the adhesive composition can exhibit a thermal conductivity ofabout 3 W/mK after curing (in a range of about 600 to 900 parts byweight relative to 100 parts by weight of the two-component total solidcontent).

Example 5

A battery module was produced in the same manner as Example 1, exceptfor using the resin composition prepared so as to have a viscosity atroom temperature of about 150,000 cP by mixing alumina (particle sizedistribution: 1 μm to 60 μm) with a two-component type urethane adhesivecomposition (main component: PP-2000 (KPX Chemical), hardener: TLA-100(manufactured by Asahi Kasei)) in an amount that the two-component typeurethane adhesive composition can exhibit a thermal conductivity ofabout 2 W/mK after curing (in a range of about 400 to 900 parts byweight relative to 100 parts by weight of the two-component total solidcontent).

Example 6

A battery module was produced in the same manner as Example 5, providedthat the module was produced by covering about 50% of the bottom platearea with the resin composition.

Comparative Example 1

A battery module was produced in the same manner as Example 2, exceptfor using the resin composition prepared so as to have a viscosity atroom temperature of about 2,000,000 cP by mixing graphite with atwo-component type silicone adhesive composition (main component:SL5100A (manufactured by KCC), hardener: SL5100B (manufactured by KCC))in an amount that the two-component type silicone adhesive compositioncan exhibit a thermal conductivity of about 1.5 W/mK after curing (in arange of about 100 to 300 parts by weight relative to 100 parts byweight of the two-component total solid content).

Comparative Example 2

A battery module was produced in the same manner as Example 2, exceptfor using the resin composition prepared so as to have a viscosity atroom temperature of about 100,000 cP by mixing alumina (particle sizedistribution: 1 μm to 60 μm) with a two-component type silicone adhesivecomposition (main component: SL5100A (manufactured by KCC), hardener:SL5100B (manufactured by KCC)) in an amount that the two-component typesilicone adhesive composition can exhibit a thermal conductivity ofabout 1.5 W/mK after curing (in a range of about 300 to 500 parts byweight relative to 100 parts by weight of the two-component total solidcontent).

Comparative Example 3

A battery module was produced in the same manner as Example 1, exceptthat the resin composition was not used, that is, the resin layer wasnot formed.

The physical properties of the resin layer and the reliability of thebattery module measured for the above Examples and Comparative Examplesare summarized in Tables 1 and 2 below.

TABLE 1 Example 1 2 3 4 5 6 Resin Layer Thermal Conductivity(W/mK) 3 33.5 3 2 2 Specific Gravity 3.1 3.1 3.2 3.2 2.6 2.6 Residue at 800° C. (%by weight) >80 >80 >80 >80 ca. 50 ca. 50 Adhesive Force(gf/10 mm) 500100 450 600 500 500 Hardness(Shore A) 90 60 90 100 70 70 BreakdownVoltage(kV/mm) 15 11 10 <8 4 4 Reliability (thermal resistance) goodgood good good fair fair Reliability (module temperature) good good goodgood Good good

TABLE 2 Comparative Example 1 2 3 Resin Layer Thermal Conductivity(W/mK)1.5 1.5 — Specific Gravity 2 2 — Residue at 800° C. ca. 60 ca. 60 — (%by weight) Adhesive Force(gf/10 mm) 80 90 — Hardness(Shore A) 40 40 —Breakdown Voltage(kV/mm) 2 5 — Reliability (thermal resistance) poorpoor poor Reliability (module temperature) poor poor poor

From the results of Tables 1 and 2, it can be seen that the physicalproperties of the resin layer are changed by the kind of resin used inthe resin layer, and the kind and ratio of the filler, and thus thereliability of the module is affected.

For example, when comparing the results of Examples 1, 2 and 4, it canbe seen that the adhesive force on adding alumina in order to secure thesame level of thermal conductivity, increases in the order of epoxy,urethane and silicone adhesives, and the hardness increases in the orderof epoxy, urethane and silicone adhesives, and it can be confirmed thatthe specific gravity and the heat resistance (TGA analysis result) areadjusted to a similar level.

In addition, when comparing the results of Examples 1, 3 and 5, it canbe confirmed that when the same series of resins have been used, thermalconductivity, specific gravity, heat resistance (TGA analysis result),hardness, and the like are changed depending on the kind and content ofthe filler. For example, in Example 5, in which a small amount of fillerwas applied compared to Examples 1 and 3, the thermal conductivity andthe specific gravity showed somewhat low values, the heat resistance(TGA analysis) was lowered, the adhesive force was in a similar level,but the hardness was lowered, and the breakdown voltage was lowered asthe ratio of the filler influencing on securing insulation was lowered.

The invention claimed is:
 1. A battery module comprising: a module casehaving a bottom plate; a plurality of battery cells; and a resin layer,wherein at least two convex portions for guiding the battery cells areformed on the bottom plate, wherein each of the plurality of batterycells is disposed in a location between adjacent ones of the at leasttwo convex portions, wherein the battery module further compriseseither: (a) a plurality of cooling plates, wherein each of the pluralityof cooling plates is disposed in a location between adjacent ones of theat least two convex portions and between said battery cells and asurface of the bottom plate, the surface being between adjacent ones ofthe at least two convex portions, wherein the resin layer fills a spacebetween the bottom plate and each of the plurality of cooling platesdisposed in a location between adjacent ones of the at least two convexportions; or (b) a cooling fin disposed in a location between adjacentones of the plurality of battery cells and positioned on one of the atleast two convex portions so as to cover an upper surface of the convexportion, wherein an end portion of the cooling fin facing the one of theat least two convex portions has a shape conforming to the convexportion such that the end portion of the cooling fin extends outwardalong opposing surfaces of the convex portion, wherein the resin layeris positioned between the convex portion and the end portion of thecooling fin while being in contact with said end portion of the coolingfin and said convex portion.
 2. The battery module according to claim 1,wherein the bottom plate comprises a region having a thermalconductivity of 10 W/mK or more.
 3. The battery module of claim 1,wherein the bottom plate is in thermal contact with a cooling medium andthe resin layer.
 4. The battery module according to claim 1, wherein theresin layer covers an area of 10% or more of the entire area of thebottom plate.
 5. The battery module according to claim 1, wherein theresin layer has a thermal conductivity of 2 W/mK or more.
 6. The batterymodule according to claim 1, wherein the resin layer has a breakdownvoltage of 10 kV/mm or more.
 7. The battery module according to claim 1,wherein the resin layer has a specific gravity of 5 or less.
 8. Thebattery module according to claim 1, wherein the resin layer has an 800°C. remaining amount of at least 70% by weight in a thermogravimetricanalysis (TGA).
 9. The battery module according to claim 1, wherein theresin layer comprises an acrylic resin, an epoxy resin, a urethaneresin, an olefin resin, an EVA resin, or a silicone resin.
 10. Thebattery module according to claim 1, wherein the resin layer comprisesfillers.
 11. The battery module according to claim 10, wherein thefillers are ceramic particles or carbon-based fillers.
 12. The batterymodule according to claim 1, wherein the resin layer comprises athixotropic agent, a diluent, a dispersant, a surface treatment agent, aflame retardant, or a coupling agent.
 13. A battery pack comprising atleast two battery modules of claim 1, wherein said at least two batterymodules are electrically connected to each other.
 14. An automobilecomprising the battery module of claim
 1. 15. An automobile comprisingthe battery pack of claim
 13. 16. A battery module comprising: a modulecase having a bottom plate; a plurality of battery cells; and a resinlayer, wherein at least two convex portions for guiding the batterycells are formed on the bottom plate, wherein each of the plurality ofbattery cells is disposed in a location between adjacent ones of the atleast two convex portions, wherein the battery module further comprises:a cooling plate disposed in a location between adjacent ones of the atleast two convex portions and between said battery cells and a surfaceof the bottom plate, the surface being between adjacent ones of the atleast two convex portions, wherein the resin layer fills a space betweenthe bottom plate and the cooling plate disposed in a location betweenadjacent ones of the at least two convex portions; and a cooling findisposed in a location between adjacent ones of the plurality of batterycells and positioned on one of the at least two convex portions so as tocover an upper surface of the convex portion, wherein the resin layer ispositioned between the convex portion and the cooling fin while being incontact with said cooling fin and said convex portion, wherein thecooling plate and the cooling fin are in direct contact.
 17. The batterymodule according to claim 16, wherein when the battery module comprisesthe cooling fin, the cooling fin has a thermal conductivity of 10 W/mKor more, and when the battery module comprises the cooling plate, thecooling plate has a thermal conductivity of 10 W/mK or more.
 18. Abattery module comprising: a module case having a bottom plate; aplurality of battery cells; and a resin layer, wherein a plurality ofconvex portions for guiding the battery cells are formed on the bottomplate, wherein each of the plurality of battery cells is disposed in alocation between adjacent ones of the plurality of convex portions,wherein the battery module further comprises: a plurality of coolingplates each respectively disposed in a location between adjacent ones ofthe a plurality of convex portions and between said battery cells and asurface of the bottom plate, the surface being between adjacent ones ofthe plurality of convex portions; and a plurality of cooling fins eachrespective disposed in a location between adjacent ones of the pluralityof battery cells and positioned on one of the plurality of convexportions so as to cover an upper surface of the respective convexportion, wherein the resin layer fills spaces between the bottom plateand the plurality of cooling plates and is positioned between theplurality of convex portion and the plurality of cooling fins whilebeing in contact with said plurality of cooling fins and said pluralityof convex portions, and wherein each of the plurality of cooling platesis in direct contact with two of the plurality of cooling fins.